December 15, 2025
Unlocking SiC Performance Through Integrated DC-Link and Power Module Design
As silicon carbide (SiC) devices continue to gain adoption in EV powertrains and industrial drives, system-level bottlenecks – particularly around switching losses, thermal constraints, and EMI – have shifted from the semiconductor itself to the surrounding passive components. One of the most overlooked yet impactful limitations is the traditional separation between the DC link capacitor and the power module. This whitepaper outlines the rationale, design considerations, and quantified benefits of a co-engineered architecture in which NanoLam™ capacitors are tightly integrated with advanced power modules, forming a single ultra-low-inductance switching platform.
